September 27, 2025

Flex Tech

Innovation in Every Curve

OE-A Highlights Flexible and Printed Electronics at productronica 2025

OE-A Highlights Flexible and Printed Electronics at productronica 2025

The OE-A and VDMA will have a joint booth during productronica in Munich from Nov. 18-21, 2025. The OE-A will highlight printed electronics on Nov. 19 and 20 through two dedicated sessions in B2: the Printed Electronics Pavilion powered by LOPEC.

These seminars will cover trending topics relevant to the industry. As a partner of productronica, OE-A will host free sessions showcasing the latest developments, future technologies, industry trends, and growth markets in flexible, organic, and printed electronics. OE-A members will present their innovations and insights.

The Printed Electronics Pavilion powered by LOPEC is located on the east side of Hall B2. The Future Production Cluster is also located in this hall. This is productronica’s special area for IT to production, Industry 4.0, manufacturing technologies for batteries and electrical energy storage systems, organic and printed electronics, 3D printing and additive manufacturing.

The schedule is as follows:

• Flexible and Printed Electronics: Applications and Technologies – Nov. 19, 2025

Moderator: Dr. Klaus Hecker, managing director, OE-A

• 2:15 pm: Introduction to Printed Electronics – Dr. Klaus Hecker

• 2:25 pm: Printed Electronics – current applications and future trends – Dr. Alain Schumacher, CTO, IEE

• 2:45 pm: Manufacturing and applications of large-area LED foils – Dr. Ashok Sridhar, CEO and co-founder, TracXon

• 3:05 pm: Hybrid electronics compared to conventional PCBs: their advantages and challenges – Jonas Deitschun, head of Department Advanced Printing Technologies, Fraunhofer IFAM

• 3:25 pm: Pilot services for supporting and accelerating flexible electronics R&D – Prof. Jukka Hast, research manager, VTT

• 3:45 pm: Debonding on demand tapes for rework, repair, and recycling in electronics – Tom Schümchen, innovation manager, Lohmann

• 4:05 pm: Summary & Adjourn – Dr. Klaus Hecker

• Flexible and Printed Electronics: Materials, Processes and Reliability – Nov. 20, 2025

Moderator: Raswanth Sendhil Sasikala, project manager, OE-A

• 2:15 pm: Introduction to Printed Electronics – Raswanth Sendhil Sasikala

• 2:25 pm: Functionalizing 3D parts with precision: pad printing as a scalable alternative manufacturing technology – Anna Ryzhova, business development manager EIMEA, Henkel

• 2:45 pm: Rebuilding the EU PCB industry by moving from chemical etching to additive printing of copper inks – Dr. Ofer Shochet, CEO and co-founder, Copprint

• 3:05 pm: Recent development on soluble materials for printed OLEDs – Dr. Junyou Pan, CTO, Zhejiang Brilliant Optoelectronic

• 3:25 pm: tbd – N.N., XTPL

• 3:45 pm: Developments in AI to enhance FHE reliability and manufacturing at scale – Wolfgang Mildner, managing director Europe, Bayflex

• 4:05 pm: tbd – Herve Javice, co-founder and CEO, I-O-Tech

• 4:25 pm: Summary & Adjourn – Raswanth Sendhil Sasikala

For more information, visit the OE-A/LOPEC in hall B2, booth 453.

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