Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets: IDTechEx

1. EXECUTIVE SUMMARY 1.1. Printed/flexible electronics: Analyst viewpoint (I) 1.2. Printed/flexible electronics: Analyst viewpoint (II) 1.3. What is printed/flexible electronics? 1.4. Motivation for printed/flexible electronics 1.5. Printed/flexible electronics and the hype curve: progressing towards product market fit 1.6. Segmenting the printed/flexible electronics industry landscape 1.7. Printed/flexible electronics in automotive applications: Overview 1.8. Overview: Printed/flexible electronics in consumer goods 1.9. Overview: Printed/flexible electronics in the energy sector 1.10. Overview: Printed/flexible electronics in healthcare / wellness 1.11. Overview: Printed/flexible electronics in infrastructure / buildings / industrial 1.12. Printed/flexible electronics area forecast by application sector (2023, 2028, 2033) 1.13. Printed/flexible electronics area forecast by application sector: 2021 – 2033 1.14. Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) 1.15. Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) 1.16. Manufacturing methods for printed/flexible electronics: Overview 1.17. Printed electronics is additive, but can be analogue or digital 1.18. Comparison of printing methods: Resolution vs throughput 1.19. Overall forecast: Analogue printing methods 1.20. Overall forecast: Digital printing methods 1.21. Manufacturing methods for printed/flexible electronics: Key conclusions 1.22. Materials for printed/flexible electronics: Overview 1.23. Overall forecast: Conductive ink volume (segmented by ink type) 1.24. Overall forecast: Conductive ink revenue (segmented by ink type) 1.25. Materials for printed/flexible electronics: Key conclusions 1.26. Components for printed/flexible electronics: Overview 1.27. Components for printed/flexible electronics: Key conclusions 2. INTRODUCTION 2.1. What is printed/flexible electronics? 2.2. Motivation for printed/flexible electronics (I) 2.3. Printed/flexible electronics and the hype curve: progressing towards product market fit 2.4. Engagement with printed/flexible electronics from the wider electronics industry 2.5. Macro-trends driving printed/flexible electronics: Increased use of AI / machine learning for continuous monitoring 2.6. Macro-trends driving printed/flexible electronics: Desire for differentiation and customization 2.7. Macro-trends driving printed/flexible electronics: Importance of sustainability 2.8. Macro-trends driving printed/flexible electronics: Transition towards ambient computing 3. MARKET FORECASTS 3.1. Overview 3.1.1. Market forecasting methodology: Applications 3.1.2. Market forecasting methodology: Materials, components and manufacturing methods 3.1.3. Printed/flexible electronics area forecast by application sector (2023, 2028, 2033) 3.1.4. Printed/flexible electronics area forecast by application sector: 2021 – 2033 3.1.5. Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) 3.1.6. Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033) 3.2. Market forecasts: Application sectors 3.2.1. Automotive applications of printed/flexible electronics by area (thousand m2) 3.2.2. Automotive applications of printed/flexible electronics by revenue (USD millions) 3.2.3. Consumer goods applications of printed/flexible electronics by area (thousand m2) 3.2.4. Consumer goods applications of printed/flexible electronics by revenue (USD millions) 3.2.5. Energy applications of printed/flexible electronics by area (thousand m2) 3.2.6. Energy applications of printed/flexible electronics by revenue (USD millions) 3.2.7. Healthcare/wellness/apparel applications of printed/flexible electronics by area (thousand m2) 3.2.8. Healthcare/wellness applications of printed/flexible electronics by revenue (USD millions) 3.2.9. Infrastructure/buildings/industrial applications of printed/flexible electronics by area (thousand m2) 3.2.10. Infrastructure/buildings/industrial applications of printed/flexible electronics by revenue (USD millions) 3.3. Market forecasts: Manufacturing methods 3.3.1. Overall forecast: Analogue printing methods 3.3.2. Overall forecast: Analogue printing methods (proportion) 3.3.3. Overall forecast: Digital printing methods 3.3.4. Overall forecast: Digital printing methods (proportion) 3.4. Market forecasts: Conductive inks 3.4.1. Overall forecast: Conductive ink volume (segmented by ink type) 3.4.2. Overall forecast: Conductive ink revenue (segmented by ink type) 4. OVERVIEW OF APPLICATION SECTORS 4.1. Introduction to application sectors 4.1.1. Application sectors for printed/flexible electronics 4.2. Application sectors: Automotive 4.2.1. Automotive applications for printed/flexible electronics: Introduction 4.2.2. Industry transitions require new differentiators 4.2.3. Printed/flexible electronics enables cost differentiation and/or cost reduction 4.2.4. Printed/flexible electronics opportunities from car interior trends 4.2.5. Printed electronics for HMI gains commercial traction 4.2.6. Increasing interest in printed heaters for surface heating in vehicles 4.2.7. Automotive transparent antennas enable windows to be functionalized 4.2.8. Printed/flexible electronics for automotive applications: SWOT analysis 4.2.9. Printed/flexible electronics in vehicle interiors: Readiness level assessment 4.2.10. Printed/flexible electronics in vehicle exteriors: Readiness level assessment 4.2.11. Automotive applications for printed/flexible electronics: Conclusions 4.3. Application sectors: Consumer goods 4.3.1. Consumer goods applications for printed/flexible electronics: Introduction 4.3.2. Embedding electronics in natural materials 4.3.3. Electronics on 3D surfaces with extruded conductive paste and inkjet printing 4.3.4. Extruded conductive paste for antennas 4.3.5. Printed RFID antennas struggle for traction: Is copper ink a solution? 4.3.6. Smart packaging with flexible hybrid electronics 4.3.7. OLEDs for smart packaging 4.3.8. Printed/flexible electronics for consumer goods: SWOT analysis 4.3.9. Consumer goods applications for printed/flexible electronics: Conclusions 4.4. Application sectors: Energy 4.4.1. Energy applications for printed/flexible electronics: Introduction 4.4.2. Conductive pastes for photovoltaics 4.4.3. Flake-based conductive inks face headwind from alternative solar cell connection technology 4.4.4. Organic photovoltaics gains traction 4.4.5. Renaissance of organic photovoltaics (OPV) continues 4.4.6. Perovskite PV shows rapid efficiency gains to be comparable with silicon 4.4.7. Companies aiming to commercialize thin film flexible PV 4.4.8. Thin film perovskite PV roadmap 4.4.9. Printed/flexible electronics for energy: SWOT analysis 4.4.10. Printed/flexible electronics for energy: Conclusions 4.5. Application sectors: Healthcare / wellness 4.5.1. Healthcare/wellness applications for printed/flexible electronics: Introduction 4.5.2. Electrochemical biosensors present a simple sensing mechanism that utilizes printed electronics 4.5.3. Interest in skin patches for continuous biometric monitoring continues 4.5.4. Material suppliers collaboration has enabled large scale trials of wearable skin patches 4.5.5. In-hospital applications remain promising but challenging 4.5.6. E-textiles and wearable sensing aims to overcome washability issues 4.5.7. Progress in using liquid metal alloys as stretchable inks for wearable electronics 4.5.8. Printed pH sensors for biological fluids 4.5.9. Key requirements of wearable electrodes 4.5.10. Increased demand for wearable/medical manufacturing leads to expansion plans 4.5.11. Smart-packaging to improve pharmaceutical compliance 4.5.12. Printed/flexible electronics for healthcare / wellness applications: SWOT analysis 4.5.13. Printed/flexible electronics for healthcare / wellness applications: SWOT analysis (II) 4.5.14. Printed/flexible electronics for healthcare / wellness applications: Readiness level 4.5.15. Printed/flexible electronics for healthcare/wellness applications: Conclusions 4.6. Application sectors: Infrastructure / buildings / industrial 4.6.1. Infrastructure / buildings / industrial applications for printed/flexible electronics: Introduction 4.6.2. Industrial asset tracking/monitoring with hybrid electronics 4.6.3. Capacitive sensors integrated into floors and wall panels 4.6.4. Printed electronics enables cost-effective building and environment sensing 4.6.5. Building integrated transparent antennas and reconfigurable intelligent surfaces 4.6.6. Material choice for passive RIS 4.6.7. Integrated electronics enable industrial monitoring 4.6.8. Integrated electronics promises customizable interiors 4.6.9. Printed/flexible electronics for building / infrastructure / industrial applications: SWOT analysis (I) 4.6.10. Printed/flexible electronics for building / infrastructure / industrial applications: SWOT analysis (II) 4.6.11. Printed/flexible electronics for infrastructure / buildings / industrial applications: Conclusions 5. MANUFACTURING METHODS FOR PRINTED/FLEXIBLE ELECTRONICS: OVERVIEW 5.1. Introduction 5.1.1. Manufacturing methods for printed/flexible electronics: Overview 5.1.2. Printed electronics is additive, but can be analogue or digital 5.1.3. Comparison of printing methods: Resolution vs throughput 5.1.4. Ensuring reliability of printed/flexible electronics is crucial 5.1.5. Digitization in manufacturing facilitates ‘printed-electronics-as-a-service’ 5.2. Manufacturing methods: 3D electronics 5.2.1. 3D electronics: Introduction 5.2.2. Additive electronics and the transition to three dimensions 5.2.3. 3D/additive electronics spans multiple length scales 5.2.4. Fully 3D printed electronics process steps 5.2.5. Interest in fully additive electronics continues with new entrant 5.2.6. Advantages of fully additively manufactured 3D electronics 5.2.7. 3D electronics: SWOT analysis 5.2.8. Readiness level of additive manufacturing technologies 5.2.9. 3D electronics: Conclusions 5.3. Manufacturing methods: Analogue manufacturing 5.3.1. Analogue printing: Introduction 5.3.2. Conventional screen printing companies continue to embrace printed/flexible electronics 5.3.3. Improvements in screen printing resolution 5.3.4. High resolution screen-printing for wrap around electrodes 5.3.5. Cliché-based printing methods 5.3.6. Highs resolutions possible with reverse offset printing 5.3.7. Analogue printing: SWOT analysis 5.3.8. Benchmarking analogue printing methods 5.3.9. Technological and commercial readiness level of analogue printing methods 5.3.10. Summary: Analogue printing methods 5.4. Manufacturing methods: Digital printing 5.4.1. Digital printing: Introduction 5.4.2. Digital printing spans multiple length scales 5.4.3. Benchmarking digital printing methods 5.4.4. Comparing deposition methods 5.4.5. Operating mechanism of laser induced forward transfer (LIFT) 5.4.6. Digital manufacturing continues to gain traction 5.4.7. Innovations in high resolution printing 5.4.8. Increased emphasis on prototyping with additive electronics 5.4.9. Digital printing: SWOT analysis 5.4.10. Digital printing: Readiness levels 5.4.11. Digital printing: Conclusions 5.5. Manufacturing methods: Flexible hybrid electronics 5.5.1. Flexible hybrid electronics: Introduction 5.5.2. FHE takes a ‘best of both’ approach 5.5.3. Flexible hybrid electronics (FHE) 5.5.4. Comparing benefits of conventional and printed/flexible electronics 5.5.5. FHE value chain: Many materials and technologies 5.5.6. Wearable skin patches – another stretchable ink application 5.5.7. Development from conventional boxed to flexible hybrid electronics will be challenging 5.5.8. Condition monitoring multimodal sensor array 5.5.9. Multi-sensor wireless asset tracking system demonstrates FHE potential 5.5.10. A new contract manufacturer for flexible hybrid electronics (FHE) emerges 5.5.11. Flexible hybrid electronics (FHE): SWOT analysis 5.5.12. Flexible hybrid electronics (FHE): Conclusions 5.6. Manufacturing methods: In-mold electronics 5.6.1. In-mold electronics (IME): Introduction 5.6.2. IME manufacturing process flow 5.6.3. Comparing smart surface manufacturing methods 5.6.4. Segmenting IME manufacturing techniques 5.6.5. Commercial advantages of IME 5.6.6. IME value chain – a development of in-mold decorating (IMD) 5.6.7. IME value chain overview 5.6.8. In-mold electronics without embedded SMD components rapidly gaining traction 5.6.9. Overview of specialist materials for IME 5.6.10. Materials for IME: A portfolio approach 5.6.11. Silver flake-based ink dominates IME 5.6.12. Overview of IME and sustainability 5.6.13. In-mold electronics: SWOT analysis: 5.6.14. Conclusions for the IME industry (I) 5.7. Manufacturing methods: R2R manufacturing 5.7.1. R2R manufacturing: Introduction 5.7.2. Can R2R manufacturing be used for high mix low volume (HMLV)? 5.7.3. What is the main commercial challenge for roll-to-roll manufacturing? 5.7.4. Examples of R2R pilot/production lines for electronics 5.7.5. Commercial printed pressure sensors production via R2R electronics 5.7.6. Emergence of a contract manufacturer for flexible hybrid electronics (FHE) 5.7.7. Applying ‘Industry 4.0’ to printed electronics with in-line monitoring 5.7.8. Applications of R2R electronics manufacturing 5.7.9. R2R manufacturing: SWOT analysis 5.7.10. R2R manufacturing: Readiness level 5.7.11. R2R manufacturing: Conclusions 6. MATERIALS FOR PRINTED/FLEXIBLE ELECTRONICS: OVERVIEW 6.1. Introduction 6.1.1. Materials for printed/flexible electronics: Overview 6.1.2. Materials supplier commercialization strategies (I) 6.1.3. Materials supplier commercialization strategies (II) 6.2. Materials: Component attachment materials 6.2.1. Component attachment material: Introduction 6.2.2. Differentiating factors amongst component attachment materials 6.2.3. Low temperature solder enables thermally fragile substrates 6.2.4. Comparing electrical component attachment materials 6.2.5. Durable and efficient component attachment is important for FHE circuit development 6.2.6. Field-aligned anisotropic conductive adhesive reaches commercialization 6.2.7. Photonic soldering gains traction 6.2.8. Component attachment materials (for printed/flexible electronics): SWOT analysis 6.2.9. Component attachment materials: Readiness level 6.2.10. Component attachment materials for printed/flexible electronics: Conclusions 6.3. Materials: Conductive inks 6.3.1. Conductive inks: Introduction 6.3.2. Conductivity requirements by application 6.3.3. Challenges of comparing conductive inks 6.3.4. Segmentation of conductive ink technologies 6.3.5. Conductive ink companies segmented by conductive material 6.3.6. Market evolution and new opportunities 6.3.7. What are the key growth markets for conductive inks? 6.3.8. Balancing differentiation and ease of adoption 6.3.9. Interest in novel conductive inks continues 6.3.10. Copper inks gaining traction but not yet widely deployed 6.3.11. Companies continue to develop and market stretchable/thermoformable materials 6.3.12. Conductive inks: SWOT analysis 6.3.13. Conductive inks: Readiness level assessment 6.3.14. Conductive inks: Conclusions 6.4. Materials: Printable semiconductors 6.4.1. Printable semiconducting materials: Introduction 6.4.2. Organic semiconductors: Advantages and disadvantages 6.4.3. Non-fullerene acceptors support OPV renaissance for non-standard applications 6.4.4. Substantial opportunities for OPD and QD materials in hybrid image sensing 6.4.5. Interest in OTFTs continues despite struggles 6.4.6. Printable semiconductors: SWOT analysis 6.4.7. Readiness level of printed semiconductors (organic and perovskite applications) 6.4.8. Printable semiconductors: Conclusions 6.5. Materials: Printable sensing materials 6.5.1. Printable sensing materials: Introduction 6.5.2. Drivers for printed/flexible sensors 6.5.3. Overview of specific printed/flexible sensor types 6.5.4. Polymeric piezoelectric materials receive increasing interest 6.5.5. Sensing for industrial IoT 6.5.6. Sensing for wearables/AR 6.5.7. Companies looking to incorporate printed/ flexible sensors often require a complete solution 6.5.8. Printable sensor materials: SWOT analysis 6.5.9. Printed sensor materials: Readiness level assessment 6.5.10. Printed sensor materials: Conclusions 6.6. Materials and components: Substrates 6.6.1. Substrates for printed/flexible electronics: Introduction 6.6.2. Cost and maximum temperature are correlated 6.6.3. Properties of typical flexible substrates 6.6.4. Comparing stretchable substrates 6.6.5. Thermoset stretchable substrate used in multiple development projects 6.6.6. Paper substrates: Advantages and disadvantages 6.6.7. Substrates: Conclusions 7. OVERVIEW OF COMPONENTS FOR PRINTED/FLEXIBLE ELECTRONICS 7.1. Introduction 7.1.1. Components for printed/flexible electronics: Overview 7.1.2. Component suppliers collaborate on smart packaging and shelf level marketing 7.1.3. Using a thin film component as a substrate: A cost-reduction strategy 7.2. Components: Electrophoretic / electrochromic displays 7.2.1. Electrophoretic / electrochromic displays: Introduction 7.2.2. Colored E-ink for vehicle exteriors 7.2.3. Electrochromic display architecture 7.2.4. Electrochromic display in packaging 7.2.5. Electrophoretic / electrochromic displays: SWOT analysis 7.2.6. Electrophoretic / electrochromic displays: Readiness level assessment 7.2.7. Electrophoretic / electrochromic displays: Conclusions 7.3. Components: Flexible batteries 7.3.1. Flexible batteries: Introduction 7.3.2. ‘Thin’, ‘flexible’ and ‘printed’ are separate properties 7.3.3. Major battery company targets printed/flexible batteries for smart packaging 7.3.4. Printed flexible batteries in development for smart packaging 7.3.5. Technology benchmarking for printed/flexible batteries 7.3.6. Flexible batteries: SWOT analysis 7.3.7. Application roadmap for printed/flexible batteries 7.3.8. Flexible batteries: Conclusions 7.4. Components: Flexible ICs 7.4.1. Flexible ICs: Introduction 7.4.2. Fully printed ICs have struggled to compete with silicon 7.4.3. Current approaches to printed logic 7.4.4. Embedding thinned silicon ICs in polymer 7.4.5. Embedding both thinned ICs and redistribution layer in flexible substrate 7.4.6. Investment into metal oxide ICs continues 7.4.7. Flexible ICs: SWOT analysis 7.4.8. Roadmap for flexible ICs 7.4.9. Flexible ICs: Conclusions 7.5. Components: Flexible PV for energy harvesting 7.5.1. Flexible PV for energy harvesting: Introduction 7.5.2. Epishine is leading the way in solar powered IoT 7.5.3. Exeger’s partnerships show promising future of DSSCs 7.5.4. Perovskite PV could be cost-effective alternative for wireless energy harvesting 7.5.5. Saule Technologies: Perovskite PV developer for indoor electronics 7.5.6. Flexible PV for energy harvesting: Readiness level assessment 7.5.7. Flexible PV for energy harvesting: SWOT analysis 7.5.8. Flexible PV for energy harvesting: 8. COMPANY PROFILES 8.1. ACI Materials 8.2. Agfa 8.3. BeFC 8.4. C3 Nano 8.5. Chasm 8.6. ChemCubed 8.7. Coatema 8.8. Copprint 8.9. CPI 8.10. DoMicro 8.11. DuPont 8.12. Elantas 8.13. Electroninks 8.14. GE Healthcare 8.15. Henkel 8.16. Heraeus 8.17. Inkron 8.18. InnovationLab 8.19. Inuru 8.20. IOTech 8.21. ISORG 8.22. Laiier 8.23. Liquid Wire 8.24. Nano Dimension 8.25. Optomec 8.26. PolyIC 8.27. PragmatIC 8.28. PrintCB 8.29. PVNanoCell 8.30. Saralon 8.31. Screentec 8.32. Sun Chemical 8.33. Sunew 8.34. Symbiose 8.35. Tactotek 8.36. TRAQC 8.37. VTT 8.38. Wiliot 8.39. Ynvisible 8.40. Ynvisible/Evonik/EpishineContact IDTechEx