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Technica USA reported that Flexible Circuits purchased their third CBT/MLI direct imaging (DI) system for their plant expansion.
Frank Medina, President of Technica USA, said, “FCI has been a long-time customer of Technica through their purchases of the CBT/MLI DI technology. We are very pleased that the management team at FCI has continued to demonstrate their loyalty in the partnership we forged many years ago with the purchase of their third DI machine. We value their business and are very pleased to have witnessed their growth throughout our partnership.”
Dave M. Stollsteimer, President of Flexible Circuits Inc., added, “We at FCI are very excited about the purchase of our third CBT / MLI direct imager. The new TiTAN Series of direct imagers will enable FCI to continually align with our core customer’s technology roadmap of driving to finer lines and spacing (sub 2 mil). Besides the quality and efficiency in process, the CBT machines also offer the low cost of ownership of an LED platform versus laser based. This will allow Flexible Circuits, Inc. to continue to service our valued customers with cost effective solutions over the long term.”
Stollsteimer continued, “Technica continues to offer us their high level of service ensuring that the equipment is never down and always working optimally. Flexible Circuits, Inc. is very proud of the long-term partnership we have with Technica and look forward to continuing the relationship far into the future.”
Medina concluded, “CBT strives to move their direct imaging technology forward on a continuous basis. The new TiTAN Series range of machines provides the market with the fastest solder mask and dry film print capability and print resolution capability down to 10 microns.”
Mike Morando, PFC Flexible Circuits
In a recent interview with Design007 Magazine managing editor Andy Shaughnessy, he asked me about rigid-flex and its new popularity. This seems like a perfect opportunity to dig into the topic and discuss the differentiation between rigid-flex, rigidized flex, and what I am calling a hybrid flex.
Andy Shaughnessy, Design007 Magazine
We recently held a roundtable with a team of printed electronic circuit experts from companies that run the gamut: John Lee and Kevin Miller of Insulectro, Mike Wagner of Butler Technologies, Tom Bianchi of Eastprint, and John Voultos of Sheldahl Flexible Technologies. In the first part of this roundtable, the team dispelled a variety of myths surrounding PEC. In this second part of the roundtable, the participants discuss what designers and fabricators need to know to jump into printed electronics, and some of the drivers behind this growing technology.
I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today’s question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?